Boson+ IQ AI Development Kit
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The Teledyne FLIR Boson+ IQ AI Development Kit is a platform designed to accelerate innovation in thermal imaging and infrared sensing. The kit integrates Teledyne FLIR’s Boson+ thermal camera technology with on-device AI processing for intelligent edge applications.

The IQ is powered by the Qualcomm Dragonwing QCS8550 platform. In the Boson+ IQ Development Kit it is bundled with the Boson camera and Prism software development kits (SDKs). Delivering up to 50 tera operations per second (TOPS) and using a multicore architecture, the IQ handles inference, general computation, and computational imaging workloads efficiently at the edge.

The multicore architecture includes two DSP cores for inference, eight CPU cores for general compute, and a GPU for computational imaging functions. The power requirement for this on-board functionality is 2.5 watts, which simplifies thermal management and maximises mission duration. The IQ runs the Prism AI object detection models and Prism ISP denoising, super resolution, and automatic gain control (AGC) for improved image quality.

The IQ supports three MIPI interfaces and allows imaging with the Boson+ thermal camera as well as additional visible or infrared sensors simultaneously. The Boson+ thermal sensor achieves a native resolution of 640 × 512 pixels and supports super-resolution output up to 1280 × 1024 at 30 to 60 Hz. This performance enables precise, real-time thermal imaging solutions that operate without reliance on cloud processing.

Teledyne FLIR designed the Boson+ IQ kit for engineers and system integrators developing AI-powered thermal imaging and sensing systems. Typical applications include aerial drones, autonomous robotics, industrial inspection, perimeter monitoring, and defence operations. By combining AI compute capabilities with the Boson+ thermal imaging platform, Teledyne FLIR provides a scalable solution for intelligent infrared sensing.

The Boson+ IQ AI Development Kit supports a range of thermal imaging and infrared sensing applications where AI-powered edge processing is required.
• Aerial Drones - Uses Boson+ thermal imaging for autonomous navigation, obstacle detection, and search and rescue operations.
• Robotics - Provides AI-driven thermal vision for object recognition and environmental awareness using Boson+ cameras.
• Industrial Inspection - Detects heat anomalies and monitors equipment temperature with precision thermal imaging.
• Perimeter and Security Monitoring - Enhances all-weather surveillance with high-resolution Boson+ thermal imaging.
• Defence and Surveillance - Supports AI-assisted target detection and situational awareness with Boson+ thermal sensors.

• Boson+ thermal camera integration with 640 × 512 native resolution and 1280 × 1024 super-resolution.
• Powered by Qualcomm Dragonwing QCS8550 for real-time AI inference on edge devices.
• Multicore architecture optimised for inference, general compute, and thermal imaging analytics.
• Frame rates of 30 to 60 Hz for smooth Boson+ thermal imaging in dynamic scenarios.
• Three MIPI interfaces supporting Boson+ cameras and additional imaging sensors.