Hadron 640 Series

Dual-sensor visible and thermal camera module for UAS, robotics and AI-enabled imaging applications.

Hadron 640 series pairs a 64 MP visible camera with a performance-leading 640 x 512 resolution radiometric Boson® or Boson+ thermal camera in a single easy-to-integrate module.

With a size, weight, and power optimised design, it is an ideal dual-sensor payload for integration into unmanned aircraft systems, unmanned ground vehicles, robotic platforms, and emerging AI applications using Teledyne FLIR Prism software.

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Hadron 640 dual thermal and visible camera module

Key Benefits

Built for integrators

ITAR-free and classified under US Department of Commerce jurisdiction as ECCN 6A003.b.4.b.

Developer support

Drivers and sample code are available for NVIDIA Jetson Nano, Qualcomm RB5, and more.

AI-ready imaging

Designed for use with Teledyne FLIR Prism AI and ISP for emerging AI applications.

High-resolution visible camera

Integrated 64 MP visible camera resolution for detailed visible imaging.

Performance thermal imaging

Available radiometric 640 x 512 Boson+ thermal camera provides industry-leading NEDT of ≤20 mK.

Compact SWaP design

Low 1.8 W steady-state power consumption and lightweight 56 g design for longer mission duration.

Integration Advantages

Hadron 640 built for integrators

Built for integrators

  • ITAR-free and classified under US Department of Commerce jurisdiction as ECCN 6A003.b.4.b.
  • Drivers and sample code available for NVIDIA Jetson Nano, Qualcomm RB5, and more.
  • Highly qualified technical services team available to support integration.
  • Evaluate capabilities with Prism Development Kit for Qualcomm RB5.
Hadron 640 thermal and visible camera performance

Industry-leading thermal and visible camera performance

  • AI-ready with Teledyne FLIR Prism AI and ISP.
  • 64 MP visible camera resolution.
  • Available radiometric, 640 x 512 resolution Boson+ provides industry-leading NEDT of ≤20 mK.
  • Flexible dual 60 Hz video output via USB or MIPI.
Hadron 640 size weight and power optimised design

Size, weight and power optimised design

  • Low steady-state power consumption at 1.8 W.
  • IP54-rated dust and water protection.
  • Lightweight 56 g design enables longer flight time and extends battery life.
  • Shared mechanical and electrical interface across all models.

Applications

Unmanned Aerial Systems

Compact dual-sensor payload for UAS imaging and inspection applications.

Security and Surveillance

Visible and thermal imaging for security, surveillance and monitoring systems.

Industrial Monitoring

Thermal and visible imaging for industrial monitoring and automated inspection.

Infrastructure Inspection

Lightweight imaging module for infrastructure inspection and remote visual assessment.

Fire Detection

Thermal imaging capability for fire detection and temperature-aware monitoring.

Features

ITAR-free and NDAA compliant

Designed for integration into a wide range of commercial and government applications.

Low power consumption

1.8 W steady-state power consumption supports longer mission duration.

Embedded platform compatibility

Compatible with NVIDIA Jetson, Qualcomm RB5, and more.

Dual video output

Simultaneous 60 Hz video output via USB or MIPI.

Shared hardware interface

Shared hardware interface across all Hadron 640 models.

High sensitivity thermal imaging

Boson+ thermal camera with ≤20 mK NEDT.

IP54 protection

Dust and water resistance for demanding integration environments.

Dual-sensor output

64 MP visible camera plus 640 x 512 radiometric thermal camera output.

Specifications

Specification Hadron 640R+
Radiometric		 Hadron 640+
Non-Radiometric		 Hadron 640R
Radiometric
Temperature Accuracy ±5°C less, over 0°C to 100°C range - ±5°C less, over 0°C to 100°C range
FOV Horizontal 32° - 32°
Temperature Measurement Yes No Yes
Software Drivers NVIDIA Jetson Nano
Qualcomm Snapdragon RB5
Qualcomm Snapdragon 865		 NVIDIA Jetson Nano
Qualcomm Snapdragon RB5
Qualcomm Snapdragon 865		 NVIDIA Jetson Nano
Qualcomm Snapdragon RB5
Qualcomm Snapdragon 865
Sensitivity [NEDT] <20 mK <20 mK <40 mK
EO Camera Sensor 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI 9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI
Frame Rate Full resolution @ 60 Hz Full resolution @ 60 Hz Full resolution @ 60 Hz
Pixel Pitch 12 µm 12 µm 12 µm
Resolution 640 x 512 640 x 512 640 x 512
IR Camera Optics EFL 13.6 mm, 32° HFOV, F/# 1.0 EFL 13.6 mm, 32° HFOV, F/# 1.0 EFL 13.6 mm, 32° HFOV, F/# 1.0
Size (L x W x H) 35 x 49 x 45 mm 35 x 49 x 45 mm 35 x 49 x 45 mm
Weight 56 g 56 g 56 g
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Downloads & Resources
Hadron 640 Series Datasheet

Need help integrating the Hadron 640 Series?

Speak with Adept Turnkey about thermal imaging, visible camera integration, embedded platforms and application requirements.

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