CMOS 3D Camera for laser triangulation applications
Developed for laser triangulation of highly reflective materials, the MV-D1024E-3D01 has a full well capacity (FWC) of 200 ke- , optimized for high dynamic range applications with a high signal-to-noise ratio and a robust algorithm for line determination which outputs the line position and qualification information for each line position value.

The user is supported by the PF Suite 3D, a graphical user interface (GUI) for a quickly evaluation of the camera and a SDK for the implementation of the 3D CMOS camera.

The camera has a CameraLink Base interface to enable image acquisition in the combined 2D/3D mode. A camera version with GigE interface allowing the acquisition of 3D profiles is available on request.

Features
• Spectral range: 400 - 900 nm	• LinLog® functionality	• FPGA image pre-processing for line position
• 2D, 3D and combined 2D/3D mode	• Configurable region of interest (ROI)	• Integrated digital reduction of fix pattern noise (FPN)
• Integrated shading correction	• Ultra-low trigger delay and low trigger jitter	• High dynamic range up to 120 dB via LinLog®
• Simultaneous 2D and 3D inspections possible	• Sub-pixel accuracy with new Peak Detector algorithm	• No additional calculations or PC are needed to obtain height profile