Linea HS2 TDI Line Scan Camera

Ultra high speed TDI imaging for light starved machine vision applications

The new Linea HS2 camera represents a breakthrough in next generation TDI technology. Designed for ultra high speed imaging in light starved conditions, this camera offers superior image quality with 8k or 16k resolution at a max line rate of 1 MHz. It has a dual CLHS data interface that achieves 16 GB/s data throughput with field-proven reliability in high-speed data transmission.

The Linea HS2 offers an easy upgrade from Teledyne’s existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5 times increase in speed while maintaining reasonable power consumption. The cameras also deliver the highest performance available, with unique features that significantly improve detectability for many demanding applications.

 

Teledyne DALSA Linea HS2 TDI line scan camera

What is TDI?

Time Delay Integration (TDI) is a specialised line scan imaging technology designed for applications where objects move at high speed or where lighting is limited. Unlike conventional line scan cameras that capture a single line of pixels, a TDI camera uses multiple sensor stages to capture the same object repeatedly as it moves across the sensor. These images are then combined electronically, significantly increasing the amount of light collected without introducing motion blur.

The result is a much brighter, cleaner image with a higher signal-to-noise ratio, making TDI cameras ideal for light-starved machine vision applications where traditional cameras may struggle.

 

How does TDI imaging work?

A TDI camera synchronises th movement of the object with the transfer of charge across multiple sensor stages. As the object moves through the camera's field of view, each stage captures another exposure of the same feature. The camera adds these exposures together, creating a single high-quality image while maintaining extremely high inspection speeds.

Technical Specifications

Technical Trait Linea HS2 8k BSI 1MHz Linea HS2 16k 1MHz BSI
Model Name Linea HS2 8k BSI 1MHz Linea HS2 16k 1MHz BSI
Part Number H2-HM-08K100H-00-B H2-HM-16K100H-00-B
Resolution 8192 x 288 16384 x 288
TDI Sensor Architecture 3 TDI arrays (128 + 128 + 32) 3 TDI arrays (128 + 128 + 32)
Pixel Size 5 µm 5 µm
Maximum Line Rate 1000 kHz 1000 kHz
Format Mono Mono
Sensor Technology CMOS Backside Illuminated (BSI) CMOS Backside Illuminated (BSI)
Supported Interfaces Camera Link HS Camera Link HS
Spectrum Capability Ultraviolet (350-400 nm), Visible (400-700 nm), Near Infrared (700-1000 nm) Ultraviolet (350-400 nm), Visible (400-700 nm), Near Infrared (700-1000 nm)
Product Status In Production In Production
ENQUIRE NOW BACK TO TOP
Downloads & Resources

Features

Backside Illumination

Features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with optimised Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications.

Configurable Sensor Architecture

The multi-array TDI sensor architecture allows the camera to be configured for superior image quality with maximised line rate, dynamic range, or full well, according to specific application requirements.

On-Chip Binning

On-chip binning enables higher web speeds to boost system throughput.

EMI Immunity

The camera is equipped with dual Camera Link HS CX4 connectors to Active Optical Cables providing complete EMI immunity.

Complete Imaging Solution

Works with Teledyne’s Xtium3 CLHS series of high-performance frame grabbers. The Xtium3 CLHS PX8 delivers data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs and allows for cable lengths over 100 metres with complete EMI immunity.

Applications

The Linea HS2 enables high speed and high sensitivity imaging in light starved conditions, making it particularly ideal for:

High density packaging inspection
Flat panel display inspection
Gene sequencing
Digital pathology

Need help with high-speed TDI imaging?

Adept Turnkey can help you select and integrate the right Teledyne DALSA Linea HS2 camera, frame grabber and optical configuration for your machine vision application.