High-speed performance at megapixel resolution: flexible 3D imaging using the triangulation technique

About the C4-1280-GigE
Acquiring height profiles and height images by means of laser sheet-of-light (triangulation) technique, a laser line is projected on the object, the resulting sensor image being evaluated by the camera core and converted into a single height profile By scanning the laser line over the object, a complete height image of the object can be acquired.

The camera's ability to complete the 3D calculations inside the camera enables it to acquire up to 72 000 profiles per second. For maximum flexibility, three profile algorithms are included without the choice of the profile influencing the profile speed. This results that the profile date are always output at the same maximum speed.

The C4 sensor is capable of delivering position data as well as additional features (eg intensity, line width) without sacrificing profile speed. An additional feature of the camera is that up to four sensor AOIs can be designed for dividing the sensor in separate subwindows.

The camera has a Gigabit-ethernet Interface (GigE Vision-compliant) and, in combination with the GenICam protocol, the efforts required for its integration are reduced to a minimum. The configuration is done in a very fast and simple way via Plug-and-play and the camera is accessed using standard interfaces making the use of manufacturer-specific software libraries is no longer necessary.

Summary of features of the C4-1280-GigE
*Non-contact 3D measurement	*1 GB image processing memory	*Image processing integrated in the camera.	*Data transmission via Gigabit Ethernet
*Selection of 3D camera algorithms	*All algorithms achieve the maximum profile rate	*Simple configuration	*Genuine global snapshot shutter for accurate profiles
*Up to 4 freely selectable AOIs	*Easy integration into machine vision systems	*Integrated control for external illumination	*Enhanced 3D imaging with High Dynamic Range 3D

Applications: suitable for a broad field of industrial 3D deployments
**  Inspection of tyres and rubber gaskets	**  Inspection of connection rods	**  Inspection of printed circuit boards
**Inspection of glue beads	**  3D inspection of packaging	**  Inspection of sintered component