Teledyne DALSA introduces Linea HS2 TDI line scan camera

Backside Illumination and Time Delay Integration for Ultra-High-Speed Imaging 

Linea HS2 TDI Line Scan Cameras

Teledyne DALSA has introduced the Linea HS2 camera, a new product in next-generation Time Delay Integration (TDI) technology. The camera is designed for high-speed imaging in light-starved conditions, offering 8k or 16k resolution at a maximum line rate of 1 MHz. It features a dual Camera Link HS (CLHS) data interface that achieves 16 GB/s data throughput for high-speed data transmission. 

The Teledyne Dalsa Linea HS2 is built as a direct upgrade from the existing Linea HS line scan cameras. It maintains the same pixel size, optics, cables, mounting hardware and a reasonable power consumption whilst providing a 2.5x times increase in speed. 

Sensor technology and system integration 

The product features a Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor. The design of backside Illuminated sensors moves sensor components out of the way which would otherwise block photons from hitting the light sensitive area of a pixel and so maximises light sensitivity.  These cameras feature 8,192 or 16,386 pixels per line and 288x lines for the time delay integration, 5 µm resolution and optimized Quantum Efficiency with the BSI design. 

Time delay integration (TDI) uses the 288x lines on the sensor and synchronises them to the motion, to accumulate the signal from successive sensor lines so that each line adds to the previous one, greatly increasing sensitivity and signal-to-noise ratio. With BSI and TDI these cameras can capture enough light in a very short exposure to allow them to run at blazingly fast speeds, a maximum of 1 million lines per second.  

The multi-array architecture allows the sensor to be configured for different applications and allows several different modes of operation, and for specific line rates, dynamic ranges, or full well requirements. It also includes on-chip binning to enable higher web speeds and system throughput.  

The camera uses dual CLHS CX4 connectors connected to Active Optical Cables to provide complete electromagnetic interference (EMI) immunity. 

For a complete imaging solution, the camera operates with Teledyne’s Xtium3 CLHS series of high-performance frame grabbers. The Xtium3 CLHS PX8 delivers data at 16 Gigapixels per second over dual CLHS CX4 connectors to active optical cables. Its data forwarding capability supports parallel data processing in up to 12 PCs, which allows for cable lengths over 100 metres with complete EMI immunity.

Features

Resolution options:  Available in 8,192 x 288 or 16,384 x 288 resolutions (3 TDI arrays: 128 + 128 + 32).
Line rate: Maximum line rate of 1000 kHz (1 MHz).
Data interface: Dual CLHS CX4 connectors delivering 16 GB/s data throughput.
Spectrum capability: Operates from Ultraviolet (300nm) through visible to Near Infrared (1000 nm) with a peak QE at 520nm, 50% (of peak) at 300nm and 6% (of peak) at 1000nm .
System compatibility: Backwards compatible with Linea HS mounting hardware, optics, and cables, and integrates with Xtium3 CLHS PX8 frame grabbers for data forwarding to up to 12 PCs.

Applications

High-density packaging inspection Enables high-speed inspection of packaged products to detect defects, misalignments, and printing errors.
Flat panel display inspection Supports rapid, high-resolution inspection of display panels for manufacturing defects.
Gene sequencing Captures high-speed, low-light biological imaging for improved DNA sequencing workflows.
Digital pathology Delivers detailed, high-throughput imaging of pathology slides for medical diagnostics and research.

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