 Teledyne FLIR has introduced the Boson+ IQ AI Development Kit, a platform designed to accelerate innovation in thermal imaging and infrared sensing. The kit integrates Teledyne FLIR’s proven Boson+ thermal camera technology with advanced on-device AI processing for intelligent edge applications.
The IQ is powered by the Qualcomm Dragonwing QCS8550 platform and in the Boson+ IQ Development Kit it comes bundled with the Boson camera and Prism software development kits (SDKs). Delivering up to 50 Tera operations per second (TOPS) and using a multicore architecture, the IQ handles inference, general computation, and computational imaging workloads efficiently at the edge.
The multicore architecture features two DSP cores for inference, eight CPU cores for general compute, and a GPU for computational imaging functions. The power required for this enhanced on-board camera functionality is just 2.5 watts, which simplifies thermal management and maximises mission duration. The IQ runs the Prism AI object detection models and Prism ISP denoising, super resolution, and automatic gain control (AGC) for superior image quality.
The IQ supports three MIPI interfaces and not only allows for the system to image with the Boson+ thermal imaging camera but also to simultaneously add additional visible or infrared sensors.
The Boson+ thermal sensor achieves a native resolution of 640 × 512 pixels and supports super-resolution output up to 1280 × 1024 at 30 to 60 Hz. This performance allows developers to build precise, real-time thermal imaging solutions that do not rely on cloud processing.
Teledyne FLIR designed the Boson+ IQ kit for engineers and system integrators creating AI-powered thermal imaging and sensing systems. Primary applications include aerial drones, autonomous robotics, industrial inspection, perimeter monitoring, and defence operations.
By combining high-performance AI compute capabilities with the reliable Boson+ thermal imaging platform, Teledyne FLIR delivers a flexible, scalable solution for developers seeking to implement intelligent infrared sensing in advanced systems.
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Applications
The Teledyne FLIR Boson+ IQ AI Development Kit supports a wide range of thermal imaging and infrared sensing applications, particularly where AI-powered edge processing is needed:
• Aerial Drones - Uses Boson+ thermal imaging for autonomous navigation, obstacle detection, and search-and-rescue operations.
• Robotics - Provides AI-driven thermal vision for object recognition and environmental awareness using Boson+ cameras.
• Industrial Inspection - Detects heat anomalies and monitors equipment temperature with precision thermal imaging.
• Perimeter and Security Monitoring - Enhances all-weather surveillance with high-resolution Boson+ thermal imaging.
• Defence and Surveillance - Supports AI-assisted target detection and situational awareness with Boson+ thermal sensors.
Features
The Boson+ IQ Development Kit combines high-performance compute, imaging quality, and integration flexibility for developers building AI-powered thermal imaging systems:
• Boson+ thermal camera integration with 640 × 512 native resolution and 1280 × 1024 super-resolution.
• Powered by Qualcomm Dragonwing QCS8550 for real-time AI inference on edge devices.
• Multicore architecture optimised for inference, general compute, and thermal imaging analytics.
• Frame rates of 30 to 60 Hz for smooth Boson+ thermal imaging in dynamic scenarios.
• Three MIPI interfaces supporting Boson+ cameras and additional imaging sensors.
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