Backside Illumination for TDI Line scan applications

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Linea HS 16k 200 kHz industry leading CMOS TDI technology

The Linea HS 16k backside illuminated (BSI) camera offers low dark current and is built for light starved imaging applications like fluorescence imaging. Teledyne Dalsa’s BSI Time Delay Integration (TDI) sensor features 5x5μm pixel size and can be clocked at a maximum line rate of 200 kHz. Linea HS is a leading TDI product family for high-speed and high-sensitivity imaging and this new 16k model breaks all barriers by incorporating backside illumination.

What is Time Delay Integration
Time Delay Integration is a technique that uses multiple lines on the sensor synchronised to image the same line on an object multiple times as it passes under the camera. The camera accumulates the charge from each line into a single line and so increases the sensitivity by the number of lines. The new 16k model has a total of 192x lines.

Why choose BSI sensor technology?
Until recently, a frontside illuminated sensor was considered the conventional approach in imaging sensor design. Frontside Illuminated sensors operate with wiring and circuitry located on the layer above the photo-sensitive layer and as such, the wiring and circuitry partially blocks light hitting the photo-sensitive layer.

BSI sensors are designed with the wiring and metal contacts connected to the back of the sensor – hence the term "Backside Illumination." By moving the circuitry out of the way, BSI sensors have a fill-factor (% of area exposed to light) close to 100% and so collect almost all photons striking the pixel. The consequence of this is that BSI pixels are more sensitive than traditional frontside illuminated pixels and so low-light performance is better.

BSI sensors feature:
Improved light sensitivity: In BSI sensors, the light reaches the photodiodes without obstruction, leading to better low-light performance.
Higher quantum efficiency: More photons are converted into electrical signals, increasing image quality and reducing noise.
Reduced crosstalk: The absence of metal wiring in front of the sensor reduces unwanted interference between pixels, improving colour accuracy.
Better Signal-to-Noise Ratio (SNR): Less noise in dark conditions results in clearer images.
Enhanced Dynamic Range: BSI sensors capture a wider range of light intensities, preserving details in both bright and dark areas.

The combination of backside illumination and time delay integration puts the HL-HM-16k20H-00-B at the cutting edge for sensitivity. Combine that with its speed and the camera becomes a highly flexible and adaptable instrument for many applications where high speed and very short exposures starve the sensor for light, or if there is very little light generated by the application.

The Linea HS 16k also features advanced capabilities including mono/HDR, colour, multifield, and super resolution imaging for demanding applications in machine vision today. The Linea HS camera uses CameraLink High Speed (CLHS) data interface in a single cable. Its active optical cable interface (AOC) enables longer cable length that eliminates the need of a repeater, significantly improves data reliability while reducing system cost.

Features
• Optimized design for fluorescence imaging with low dark current
• Multi-array charge-domain CMOS TDI BSI sensor with high QE >90%
• High speed 200kHz max linerate
• High sensitivity, in particular, for near UV/blue wavelengths
• High resolution 16k/5um pixels
• Next generation Camera Link HS interface with field proven data reliability
• Support active optical cables (AOCs) for extended cable lengths to 100M
 
Applications
Life sciences: In DNA sequencing and digital pathology, the camera's high resolution and high sensitivity allow for the detection of minute and low contrast details in biological samples.
General machine vision: For applications such as web inspection and printed circuit board examination, the camera's sensitivity and speed allow for short exposures to provide advanced features for precise and rapid imaging, improving manufacturing efficiency.
• Digital pathology
• PCB inspection
• Food inspection
   
Specifications
HL-HM-16K20H-00-B
Sensor type Multi-array charge-domain CMOS TDI BSI
Resolution 16384 x 192
Pixel size 5x5 μm
Peak responsivity 780 DN8/(nj/cm2) @ 1x gain in 8 bit (main array)
Max line rate 400 kHz (mono mode)
200 kHz x 2 (HDR mode)
Bit depth 8 or 12 bit selectable

 

 

Need a price or more application information? Please email Adept Turnkey or call our offices
Adept Turnkey Pty Ltd are "The Machine Vision and Imaging Specialists" and distributor of Teledyne Dalsa products in Australia and New Zealand. To find out more about the Linea HS or any Teledyne Dalsa product, please call Adept Turnkey at Perth (08) 9242 5411 / Sydney (02) 9905 5551 / Melbourne (03) 9384 1775 or contact us online.