Optimom 5D Turnkey Imaging Module for Robotics, Logistics, and Security

Optimom 5D, powered by the Topaz5D™ image sensor from Teledyne e2v, brings precision and detail to 2D and 3D imaging in compact applications. Designed for applications like robotic guidance, logistics optimisation, and anti-spoofing, this versatile, board-level camera solution provides high-quality, full-HD 2D and 3D data, seamlessly integrated for demanding environments.

At the core of the Optimom 5D is the Topaz5D image sensor, a 2-megapixel (1920 x 1080) device with global shutter technology. The Topaz5D sensor is built on Teledyne e2v's proprietary CMOS platform and incorporates 3D post-processing optical layers. These features enable the sensor to capture detailed 2D images and generate 3D depth data in real-time, ensuring that every image is rich in detail and spatial accuracy.

The Topaz5D sensor’s compact size is another standout feature. With 2.5 μm pixel spacing and housed in Chip Scale Packaging (CSP), this module is optimised for space-constrained applications such as mobile robots, autonomous drones, and handheld devices.

The Topaz5D sensor also incorporates Angular Sensitive Pixel (ASP) technology. This capability allows the sensor to generate raw 3D data, directly accessible for software processing of 3D depth maps

Seamless Operation in Real-World Environments
Optimom 5D is designed to perform reliably in diverse lighting conditions, indoors and outdoors, without additional lighting hardware. Its low-noise global shutter minimises image blur, capturing fast-moving objects with clarity. For applications in logistics, this is a game-changer, as packages and materials can be tracked with high spatial fidelity even under challenging warehouse lighting. In anti-spoofing security applications, the precision of the 3D depth data allows systems to differentiate between flat images and real faces, enhancing security in authentication systems.

The Optimom 5D’s image data is transmitted over a standard MIPI-CSI2 interface, allowing for easy integration with existing processing systems and reducing the need for custom interfacing.