Engineered for sensitivity

High-contrast, sharp images even in low light
Powered by an advanced OnSemi PYTHON sensor, the EoSens CXP+ series bring combination of speed, resolution and responsiveness and the EoSens series now includes the 12CXP+ (12MP) and 25CXP+ (25MP), two high-definition, light-sensitive models which, even in low light conditions, deliver high-contrast, sharp images. ** The EOSens 25CXP+ features a higher sensitivity sensor than the older model EOSens 25CXP.

The EOSens CXP+ is a tethered high speed camera that connects to a computer and outputs at high speed in real time for the data to be captured and stored on the computer. This allows for much longer record times than those high speed cameras that have memory in-built and store the high speed data on board. Fast output data transfer is provided for with a CXP-6 CoaXPress® interface** which transfers data volumes at up to 25 GBit/s in real time. It transfers high-resolution images with precise triggering and enables immediate evaluation and processing on the computer without long data transfer times. The Coaxpress interface uses standard low cost off-the-shelf coax cables to connect from the camera to the the host system.

Contained within a robust and compact metal housing with fanless design, the EOSens CXP+ cameras are engineered for use in rough industrial environments and are rated to 70g shock and 7gms Vibration.

The EoSens® 25CXP+ captures 80 frames-per-second at 5120x5120 pixels resolution while the EoSens® 12CXP+ version captures 165 images per second at 4096x3072 pixels resolution. This high resolution, combined with advanced image enhancement features and impressive speed, allows the acquisition of even the smallest, low contrast, fast moving features in a scene.

• High resolution at high frame rates

• 25 GBit/s data transfer rate for real-time streaming

• Shock and vibration proof

• EMVA1288 standardized reporting

• Largest model measures just 80 x 80 x 66 mm

• Fanless design for ruuged environments

• High reliability: MTBF > 200,000 hours

• PCB inspection

• PIV measurements

• Laser cutting quality

• Ballistics

• Ball grid inspection

• Material testing

• Robot control

• Explosives

• LCD panel inspection

• Trajectory reconstruction

• Laser triangulation

• Rocket testing

• Wafer inspection

• Motion analysis

• Material sorting

• Aerial surveillance