3D Cameras
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Industrial 3D cameras use a range of different techniques to measure object shape (3D) at high speed while at the same time, measuring other object features.

Some of the different techniques used by 3D cameras include:
Sheet-of-light triangulation (laser profiling) where object profiles are measured using a laser sheet-of-light (triangulation) technique where a laser line is projected on the object, the resulting sensor image being evaluated by the camera core and converted into a single height profile By scanning the laser line over the object, a complete height image of the object can be acquired. The sensor is capable of delivering position data as well as additional features (eg intensity, line width) without sacrificing profile speed.

Time-of-flight - A time-of-flight camera is a 3D vision system that creates distance data using the a principle where the entire "scene" is captured with each laser or light pulse. The result of recent semiconductor innovation, the 3D camera system covers distances from a few meters up to several metres, depending on the detector material being used. At the heart of the camera is an advanced sensor technology employing the time-of-flight distance measurement principle where infrared light from the camera's internal lighting source is reflected by objects in the scene and travels back to the camera where its precise time of arrival is measured independently by each of tens of thousands of sensor pixels.

3D cameras are available and in both GigE and Cameralink interfaces; some as ruggedized models for harsh environments.

Model	Scan rate/speed	Resolution (Z) mm	Resolution (X) mm	Clearance distance (mm)	Measurement distance (mm)	Field of view (mm)	Interface
Gocator 2300 series: 3D megapixel smart sensors
2330	Approx. 170Hz to 5000 Hz	0.006 - 0.014	0.044 - 0.075	90	80	47 - 85	Gigabit Ethernet
2340	Approx. 170Hz to 5000 Hz	0.013 - 0.037	0.095 - 0.170	190	210	96 - 194	Gigabit Ethernet
2350	Approx. 170Hz to 5000 Hz	0.019 - 0.060	0.150 - 0.300	300	400	158 - 365	Gigabit Ethernet
2370	Approx. 170Hz to 5000 Hz	0.053 - 0.173	0.275 - 0.550	400	500	308 - 687	Gigabit Ethernet
2380	Approx. 170Hz to 5000 Hz	0.071- 0.413	0.375 - 1.100	350	800	390 - 1260	Gigabit Ethernet

Photonfocus - 3D CMOS Laser Profile cameras
Model	Resolution	Sensor	Pixel Size	Video Output	Frame rate	Pixel scan
MV-D1024E-3D01-160-CL	1024 x 1024	CMOS	10.6 µm x 10.6 µm	CameraLink (GigE on request)	150 fps	160 MHz
MV-D1312-3D02-160-G2-8	1312 x 1080	CMOS	8 µm x µm	GigE (cameras available on request)	108 fps
MV1-D2048 x 1088-3D03- 160- G2 - 8	2048 x 1088	CMOS	5.5µm x 5.5 µm	GigE	340 fps

Vision Components - Smart, laser profile, 3D cameras
Model	Scan Rate	Working Distance	Horizontal measure range	Vertical measure range	Resolution lateral	Laser
VC nano 3D xr830	up to 400 Hz	150 mm	60 - 120 mm	± 55 mm	100 - 200 µm	Class 1
VC nano 3D xr845	up to 400 Hz	80 mm	50 - 70 mm	± 25 mm	80 - 100 µm	Class 1
VC nano 3D xr1245	up to 400 Hz	80 mm	35 - 45 mm	± 20mm	30 - 40 µm	Class 1

iDS Imaging - Stereo cameras with new "projected Texture stereo vision"
Model	Sensor	Resolution	Frame rate	Working distance	Z-resolution	Output
Ensenso N10	2 x CMOS	752 x 480 pixel (WVGA)	30 fps	280 - 1400 mm	0,1 bis 1,2 mm	USB 2.0

Adept Turnkey can support the 3D-measurement requirements of your projects and will be pleased to consult with you and discuss which 3D camera best suits your application.
Please contact us